SalaryPeak

Senior Staff Engineer, RD Packaging & Module Engineering

AMS-OSRAM ASIA PACIFIC PTE. LTD.
Singapore 5+ years Posted May 11, 2026

Salary Range

SGD 108,000 - SGD 144,000 /year

SGD 9,000 - SGD 12,000/month

Skills Required

Liaising with cross functional teamsmanufacturing environmentYield AnalysisEngineering DocumentationOptical EngineeringContinuous Improvement ManagementElectricalmentorship to junior staffProduct DevelopmentElectrical Engineering ManagementChemical EngineeringElectronicsFailure Analysis

Job Description

Responsibilities

  • Lead end-to-end product development from concept, feasibility, design validation, qualification to production ramp
  • Mentor junior engineers and provide technical leadership within the team
  • Develop and execute prototype build/ new materials characterization, including optical, electrical and mechanical assessment with DOE (Design of Experiment) execution.
  • Lead and resolve major issues during project and maintain documentations pertaining to engineering root cause findings
  • Collaborate and drive cross functional integration across design process, packaging, test, reliability and production teams
  • Analyse parametric and yield data to identify trends and drive root cause analysis. Support yield improvement, failure analysis, and reliability testing activities.
  • Create and maintain engineering documentations including BOM, defect catalog, control plans and ERS.
  • Drive continuous improvements in development methodologies, cost and cycle time


Requirements:

  • Degree in Electrical, Electronics, Mechanical, Microelectronics, Materials, Optics or Chemical Engineering
  • > 5 years in either R&D, packaging technologies, manufacturing environment
  • Experience in sensor module packaging and/or optical engineering will be an advantage.
  • Ability to lead/mentor junior team members and providing technical expertise in coaching them