SalaryPeak

Staff Engineer, RD Packaging & Module Engineering (Fresh graduate are welcome )

AMS-OSRAM ASIA PACIFIC PTE. LTD.
Singapore 3+ years Posted May 11, 2026

Salary Range

SGD 48,000 - SGD 90,000 /year

SGD 4,000 - SGD 7,500/month

Skills Required

Graduate RecruitmentLiaising with cross functional teamsMaterialsMicroelectronicsOptical EngineeringRoot Cause AnalysisElectricalMechanicalYield ManagementOpticsManufacturingChemical EngineeringElectronics

Job Description

Responsibilities

  • Assist in integrating and optimizing end-to-end manufacturing process to meet product specifications and performance targets
  • Monitor process performance, yield trends and key quality indicators
  • Supporting root cause analysis and implement corrective actions for process and product-related issues
  • Working with process and product development engineers to create process flow and initial equipment list required in projects
  • Collaborate with cross-functional teams to resolve product or process-related issues
  • Developing and maintaining documentations like FMEA, machine and process buy-off document


Requirements:

  • Degree in Electrical, Electronics, Mechanical, Microelectronics, Materials, Optics or Chemical Engineering
  • Preferred 3 - 5 years in either R&D, packaging technologies, manufacturing.
  • Fresh graduates will be considered.
  • Experience in sensor module packaging and/or optical engineering will be an advantage.