Application Engineer [Semiconductor | Process Development | Customer Support | Dicer/Grinder/Laser | Blade & Wheel Technical Support]

[Job ID: 1106917]

Responsibilities:

• Provide process development support for customers.

• Perform in-house application test cuts and provide on-site customer support.

• Process customer claims for abrasive products.

• Communicate frequently with engineers from Japan.

• Participate in company-organized activities.

• Promote good interdepartmental relationships.

• Establish and maintain strong relationships with customers.

• Perform any other ad-hoc tasks as assigned.

Requirements:

• Minimum 1-year relevant working experience, preferably in the semiconductor industry.

• Knowledge or experience with Dicer, Grinder, or Laser equipment is preferred.

• Strong understanding of blade, wheel, and Laser technical support.

• Diploma in Mechanical, Electronic, or any other engineering discipline.

• Entry level candidates are welcomed to apply

To apply:
Send your updated resume to [email protected]

We regret that only shortlisted candidates will be notified. However, all applications will be updated to our resume bank for future opportunities.

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EA Licence No.: 07C5771
EA Personnel Reg. No.: R24122504
EA Personnel Name: Edmund Ting Chao Siong
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