Your Role

Key responsibilities in your new role

Drive MEMS Package Technology Development at Infineon, from concept to high-volume ramp-up.
Act as the lead engineer and primary point of contact for direct communication with Infineon’s key customers regarding MEMS package technology.
Perform process development activities (including parameter scouting, optimization, verification, and process freeze) within development projects to achieve targets related to timeline, quality, cost competitiveness, and manufacturability.
Define and drive technical specifications (BOM, package design, assembly process) for MEMS package projects involving major changes, risks, or new introductions.
Lead a global team of process development engineers to successfully execute multiple MEMS package NPI (New Product Introduction) projects. Share your technical expertise and foster professional growth within your team.
Serve as the partner and technical consultant for package definition activities, collaborating closely with the Business Division, particularly on aspects of MEMS and Silicon Microphone back-end (BE) assembly technology.
Provide support during the pre-development and project definition stages, maintaining your role as the package design expert throughout the project lifecycle.
Innovate novel MEMS package concepts, leveraging your experience as a technical leader.

Your Profile

Qualifications and skills to help you succeed

Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics, or similar).
Minimum of 9 years of relevant experience in MEMS package technology development.
Demonstrated success and proven track record in developing innovative MEMS Silicon Microphone technologies.
Experience in representing your company as a MEMS package expert, with direct communication to Tier 1 customers.
Comprehensive knowledge of MEMS packaging processes, materials, and equipment engineering.
Proven ability to lead and mentor a team of process development engineers in MEMS package development.
Hands-on experience collaborating with OSATs (Outsourced Semiconductor Assembly and Test providers) in package development projects.
Expertise in Failure Analysis and Reliability Engineering methodologies.
Strong analytical and problem-solving skills including 8D and FMEA.
Proficiency in AutoCAD and 3D drafting tools.
Highly motivated, driven to excel and grow within Infineon, and thrives on tackling challenges to deliver innovative solutions

Principal Engineer Package Development