Principal/Sr Engineer, Advance Packaging Process Engineering

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The team is looking for a motivated and experienced individual contributor for this position in Process Development team.

Roles & Responsibilities:

• Developing, configuring and optimizing Package Assembly processes (front end, bonding and back end) for Micron's memory from pathfinding through to NPI start up and certification side by side with Manufacturing teams to optimizing advance packaging process from DOE through NPI start up.

• Assessing processes by knowledge and skills, taking measurements and interpreting data

• Involved in the design approvals (Substrate and Silicon), running, testing and upgrading systems and processes, approving the materials, process and equipment changes in the CCB (change control board).

• Path finding of innovative package technology: Deep fundamental understanding of the key risks in Bumping, Flip chip and HBM technologies. Actual experience with TCB (Thermal Compression Bonding), CMP (Chemical Mechanical Polish), WSS (Wafer Support System), photo process and Ball Mount is a plus.  Change to this: Deep fundamental understanding of the key risks in Bumping, Flip chip and HBM technologies. Actual experience with TCB (Thermal Compression Bonding), CMP (Chemical Mechanical Polish), WSS (Wafer Support System), photo process and Ball Mount is a plus.

• Hands-on integration experience in Package Assembly and Wafer Level package process are needed, may need to conduct the supplier interactions/meetings and drive new NDAs with new projects, which all together requires a significant understanding of the processes, first principles and process control systems. 

Requirements

• Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Physics, or related field.

• Minimum of 3 years of experience in semiconductor manufacturing or related fields.

• Proven track record in yield management and driving yield improvement initiatives.

• Flexibility to support operation including shift -based work and periodic weekend coverage based on critical business needs.

• Deep understanding of semiconductor manufacturing processes, yield analysis, and statistical process control (SPC).

• Hands-on experience with data analysis tools such as JMP, or equivalent.

• Strong communication skills, and able to present complex technical data and trends to leadership and non-technical audiences.

• Proven ability to work with multi-functional teams and influence partners to achieve strategic goals.

• Problem-Solving Skills: Strong analytical skills with the ability to troubleshoot and resolve complex technical issues in a high-pressure environment.

• Project Management: Ability to manage numerous projects simultaneously and prioritize tasks in a fast-paced environment.

• Cross-Cultural Communication: Experience working with teams across different geographies and cultures.

• Possess Micron Values: People, Innovation, Tenacity, Collaboration and Customer Focus
  

  Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.