Staff Engineer, Package Development & Engineering

The PDE Pillar Lead will provide technical leadership and strategic oversight for advanced packaging initiatives within the Advanced Packaging & Technology Development organization. This role is accountable for driving technology enablement, yield acceleration, and seamless integration of next-generation packaging solutions. The Pillar Lead will establish governance frameworks, optimize development workflows, and ensure alignment with PDE’s charter to deliver cutting-edge packaging technologies.

Key Responsibilities

Technical Leadership & Program Execution

• Own the full lifecycle of PDE technology pillars, including roadmap definition, execution, and closure.

• Define technical objectives, key deliverables, and resource allocation for pillar initiatives.

• Lead cross-functional engineering teams across TD, HVM, CPI, DRAM, and NPI to achieve aggressive technology milestones.

Governance & Operational Excellence

• Develop and enforce standardized methodologies for technical program management and pillar governance.

• Drive CapEx/OpEx planning, PTM and MOR processes, and integration of BOP design systems.

• Ensure compliance with internal governance models and customer technical requirements.

Strategic Alignment & Technical Communication

• Align pillar objectives with PDE’s mission to embed analytics, simulation, and advanced modeling into development workflows.

• Facilitate technical communication across BU, PDT, TPM, and central engineering teams.

• Provide leadership updates on technical progress, risks, and mitigation strategies.

Performance & Continuous Improvement

• Define and monitor KPIs for technology maturity, yield performance, and EOL accountability.

• Conduct technical reviews to validate outcomes and capture lessons learned.

• Mentor engineers and promote best practices for technical program management.

Qualifications

• Bachelor’s or Master’s degree in Engineering, Materials Science, or related technical discipline.

• 8+ years of experience in semiconductor packaging, process integration, or technology development.

• Proven ability to lead complex, cross-functional technical programs in a high-tech environment.

• Deep understanding of advanced packaging flows including hybrid bonding, CoWoS, and chiplet integration.

• Strong technical communication and leadership skills.

Preferred Skills

• Familiarity with Micron’s PDE, CPI, and NPI frameworks.

• Expertise in simulation modeling, yield enhancement, and defectivity analysis.