SalaryPeak

Engineer, Process (Backend)

SILICON BOX PTE. LTD.
Singapore 3+ years Posted Jan 28, 2026

Salary Range

SGD 48,000 - SGD 84,000 /year

SGD 4,000 - SGD 7,000/month

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Skills Required

TapeMASSIVEFMEATuningCharacterizationPackagingProduction LineSPCAuditsMonetizationDockerVideo EncodingDispositionICMechanical Engineering

Job Description

Position Summary

The Process Engineer is responsible for development and establishment of production process. 

Responsibilities

  • Responsible for Backend process: Pick and Place / SMT and SMD / Ball Drop / Reflow / Laser Marking / Tape and Reel / Singulation / Packing / AOI, etc.  

  • Establish, review and update specifications, workflow, quality and safety related documentation for production line.  

  • Troubleshoot process issue and improve process capabilities, yield and cycle time from customer NPI stage to LVM/HVM stage.  

  • Process sustaining and control through SPC and periodic defect Pareto Analysis.  

  • Lead and drive SPC control.  

  • Review and maintain FMEA, Control plan, OCAP with cross-functional teams.  

  • Handle and manage customer audits and 8D reports.  

  • Provide disposition for engineering and production lots.  

  • Conduct process characterization and qualification to establish process baseline. 

  • Coordinate and liaise with vendor/suppliers on process issue or quality issue.  

  • Support customer NPI activities and internal engineering activities.  

  • New material, process & machine development and qualification.  

  • Review and accept machine buyoff, setup pilot line process and transfer from pilot line to production line 

  • Any other ad-hoc duties as assigned by supervisor 

Requirement

  • Minimum bachelor's degree in material science, microelectronics, mechanical engineering or relevant engineering field  

  • At least 3 years of experience in semiconductor manufacturing industry and working in cleanroom environment  

  • Hands-on process experience in Backend Process: Pick and Place / SMT and SMD / Ball Drop / Reflow / Laser Marking / Tape and Reel / Singulation / Packing / AOI, etc within semiconductor IC packaging industry 

  • Experience in SPC, DPE, FMEA, OCAP, WI, CPK, PPK, 4D/8D report