SalaryPeak

Senior/Principal Engineer, Process Integration, NAND, NTI

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.
Singapore 5+ years Posted Feb 25, 2026

Salary Range

SGD 72,000 - SGD 120,000 /year

SGD 6,000 - SGD 10,000/month

Skills Required

TableauMaterials ScienceBSS (Business Support Systems)MicroelectronicsSemiconductor IndustryProcess IntegrationElectricalComputer ProficiencyPythonElectrical Engineering (including power engineerinPower BIElectrical EngineeringChemical EngineeringElectronics

Job Description

As a Senior/Principal NAND Module Process Integration Engineer in the Singapore R&D department at Micron Technology Inc., you will be responsible for designing, developing, integrating, and implementing innovative and effective process solutions to improve next-generation 3D NAND Product Yield and Quality with competitive cost and performance within the required timeline.

Your responsibilities will include, but are not limited to, the following:

  • Identify and quantify key module deficiencies and technology gaps. Lead cross-functional teams to address these issues. Improve current process flows and develop innovative solutions to meet product requirements and manufacturability.

  • Develop or redefine CSPEC criteria for optimal product performance and drive activities to ensure manufacturing process capability.

  • Coordinate activities at the manufacturing site to secure funding for experiments, and conversions, and effectively communicate decisions to relevant R&D, Product Engineering, and Manufacturing partners.

  • Undertake development projects to evaluate and implement new integration schemes for alpha and derivative part types. Establish proof of concept for future tech nodes at the manufacturing facility.

  • Take on a leadership role at quarterly yield summits and monthly program reviews to summarize complex problems, explain actions taken to address them, and align R&D, Manufacturing, and senior management teams.

  • Assist in the transfer of new technology from R&D to manufacturing. Contribute to ensuring a successful ramp-up and qualification. Support the transfer, documentation, and training of module fundamentals into manufacturing.

Successful candidates for this position,

Must have:

  • Passion in semiconductor technology and innovation

  • Adept at data analysis, problem-solving, and process integration optimization

  • Excellent communication skills and ability to work in cross-functional teams

  • Committed to quality, collaboration, and continuous improvement

  • Ability to be self-motivated, and self-governing with proven ability to work in a demanding & dynamic environment

  • Ability to travel for extended periods to the US for collaborative R&D work

Requirements:

  • BS, MS/PhD in Electrical Engineering, Microelectronics, CHemical Engineering, Material Science or a related field

  • Proficiency in scripting/programming/engineering/business intelligence/Analytics software, such as Python, SolidWorks, Tableau, Power BI, etc. is desirable.

  • Minimum of 3 years of experience in the semiconductor industry in the areas of Process Integration and Yield Enhancement.

  • Ability to develop a strong holistic end-to-end understanding of particular PI modules on new NAND technologies and related structural & electrical fail mechanisms.

  • In-depth knowledge and direct experience with non-volatile memories (NAND) along with good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues are desirable.

  • Exposure to R&D and transfer/manufacturing is desirable.