Staff Packaging Engineer

THE ROLE:

We are seeking a Staff Packaging Engineer to lead advanced package industrialization from NPI through HVM, driving DFM integration and manufacturing readiness with OSAT partners in multiple countries to ensure stable ramp, yield, quality, and delivery performance.

THE PERSON:

Based in Singapore, you will work closely with OSAT operations and engineering teams across multiple countries, partnering daily with manufacturing engineering, quality, and operations to establish/maintain POR, close manufacturing gaps, and rapidly resolve factory issues across advanced packaging technologies (e.g., 2.5D interposer and fan-out).

Collaborate cross-functionally (design, substrate, reliability, test, quality, supply chain, and program management) and apply structured methodologies (DFM/DOE/SPC/FMEA/8D) to drive risk reduction and ramp readiness.

This is an execution-driven role requiring strong advanced packaging process expertise, manufacturing / operations acumen, and the ability to influence across global teams and external partners to deliver robust, scalable production.

KEY RESPONSIBILITIES:

NPI to HVM Industrialization

• Lead end-to-end industrialization of advanced package technologies from NPI through HVM readiness across external assembly/test manufacturing partners and foundry partners.
• Own NPI-to-HVM execution: lead readiness reviews, drive risk mitigation, and govern ramp activities; collaborate closely with OSAT engineering teams on process development, qualification, and optimization to ensure robust, scalable, and manufacturable assembly and test solutions across sites.

Design for Manufacturing (DFM) Integration

• Primary interface between package design/technology development and external manufacturing partners to ensure manufacturable architecture and clear DFM requirements.
• Identify/close manufacturability gaps early; drive technology-to-manufacturing transfer and best-practice deployment.

External Supplier Manufacturing Management

• Partner with outsourced manufacturing sites to ensure manufacturing capability, capacity readiness, and process maturity for advanced packaging platforms.
• Drive yield, cycle time, quality, and delivery performance; lead defect reduction and yield improvement with site teams.
• Provide hands-on execution leadership OSATs: lead daily/weekly manufacturing reviews, expedite issue triage with site teams, and align action owners across manufacturing, quality, and supply chain to protect ramp and delivery.
• Manage out-of-control lot disposition; implement CAPA and share BKM.
• Lead technical reviews, audits, ramp readiness assessments, and coordinated change management with internal/external stakeholders.

Yield, Quality, and Process Control

• Drive process control and continuous improvement using DOE/SPC/FMEA and data-driven root cause analysis.
• Lead cross-functional investigations for yield excursions, reliability risks, and field quality issues, ensuring timely containment and corrective actions (8D).
• Develop monitoring/early-detection mechanisms and ensure alignment to quality, reliability, and qualification requirements.

Cross-Functional Program Execution

• Partner cross-functionally (design, tech dev, reliability, product/test, quality, supply chain, program management) to align deliverables and execute to plan.
• Drive readiness reviews and risk assessments; track actions and communicate clear status/escalations to stakeholders.
• Support program teams in achieving cost, schedule, capacity, and production targets for Enterprise, Client, and AI accelerator products.

PREFERRED EXPERIENCE:

• Experience in semiconductor packaging/assembly manufacturing or product engineering, with strong on-site execution in high-volume environments.
• Proven NPI and ramp leadership, including supplier management, process qualification, manufacturing readiness, and yield ramp monitoring.
• Demonstrated ability to work effectively with OSAT manufacturing operations in multiple countries, including structured communication, escalation management, and fast-turn coordination across site teams and global stakeholders.
• Demonstrated success in yield improvement/defect reduction, root-cause closure, and disciplined change management in HVM.
• Hands-on advanced packaging experience (e.g., 2.5D interposer, fan-out, 3D, high-density flip-chip; plus RDL/TCB/hybrid bonding familiarity) with OSAT/factory interface experience.
• Strong problem-solving and analytics using structured methods (DOE/SPC/FMEA/8D) and manufacturing data to drive decisions.
• Strong stakeholder management across cross-functional teams and external partners; able to translate issues into clear action plans and drive closure.
• Professional fluency in English, Mandarin, and Korean to support technical documentation, stakeholder communication, and cross‑site engineering collaboration across APAC.

ACADEMIC CREDENTIALS:

• Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, Chemical Engineering, or a related engineering discipline.