SR/PRINCIPAL ENGINEER, FE CPIE RAM QUALITY and OPNS ENGINEERING

Responsibilities

• Develop strategies, models, and systems to:

• Reduce wafer-at-risk and strengthen RAM defense line hardening.

• Improve RAM quality control and minimize defect variation.

• Enhance operational efficiency to achieve labor productivity, cycle time performance, and tool utilization for cost reduction.

• Establish and maintain Best Known Methods (BKM) for RAM defense and operational efficiency, ensuring sharing across all sites.

• Conduct abnormal analysis and implement corrective actions.

• Lead Copy Smart Team (CST), facilitate taskforce discussions, and drive RAM network alignment on strategy, processes, and roadmap.

• Support audits and establish metrics to monitor adoption and compliance with processes and BKMs.

• Proactively provide recommendations for program and process optimization.

• Manage projects using structured project management practices and success metrics.

• Track and benchmark Fab performance; identify gaps and improvement opportunities.

• Provide tactical support for issues related to people, safety, yield, quality, cost, and cycle time.

• Communicate strategies and updates effectively to network members and leadership.

Requirements

• Bachelor’s or Master’s degree in Engineering.

• Relevant experience in RDA and/or Metrology.

• Willingness and ability to travel internationally, including extended assignments (up to 6 months).

• Strong communication skills and ability to collaborate across functional teams.

• Ability to promote global knowledge sharing.

• Preferred skills:

• Capacity modeling, wafer risk modeling.

• FMEA, defect analysis tools, sampling strategies.

• SPC tools, cycle time management.

• Tableau, SQL, programming languages.

• Organizational change management.